ICM-42670-P

ICM-42670-P – 6-Axis MEMS MotionTracking™ Device

📌 Product Overview

The ICM-42670-P is a high-performance 6-axis MEMS MotionTracking™ device from TDK InvenSense that combines a 3-axis gyroscope and a 3-axis accelerometer in a compact 2.5mm × 3mm × 0.76mm 14-pin LGA package[citation:2][citation:3][citation:6]. Designed as a cost-optimal, lowest-power IMU with advanced motion features, it integrates an on-chip APEX Motion Processing engine for gesture recognition, pedometer, and tilt detection, along with programmable digital filters and an embedded temperature sensor[citation:6][citation:11].

Category:

ICM-42670-P – 6-Axis MEMS MotionTracking™ Device

📌 Product Overview

The ICM-42670-P is a high-performance 6-axis MEMS MotionTracking™ device from TDK InvenSense that combines a 3-axis gyroscope and a 3-axis accelerometer in a compact 2.5mm × 3mm × 0.76mm 14-pin LGA package[citation:2][citation:3][citation:6]. Designed as a cost-optimal, lowest-power IMU with advanced motion features, it integrates an on-chip APEX Motion Processing engine for gesture recognition, pedometer, and tilt detection, along with programmable digital filters and an embedded temperature sensor[citation:6][citation:11].


⚙️ Key Specifications

Parameter Value
Sensor Type 6-Axis IMU (Accelerometer + Gyroscope + Temperature)
Gyroscope FSR ±250 / ±500 / ±1000 / ±2000 dps
Accelerometer FSR ±2g / ±4g / ±8g / ±16g
Gyro Rate Noise 0.007 dps/√Hz
Accel Noise 90 – 100 μg/√Hz
Low-Noise 6-Axis Current 0.55 mA (typical)
Sleep Mode Current 3.5 µA
VDD Operating Voltage 1.71V to 3.6V
Host Interfaces I²C (1MHz), I3C℠ (12.5MHz), SPI (24MHz)
FIFO Buffer Size 2.25 KB
Package Dimensions 2.5mm × 3.0mm × 0.76mm (14-LGA)
Operating Temperature -40°C to +85°C
Shock Immunity Up to 20,000g

✨ Key Features

  • Ultra-Low Power Consumption – Low-noise 6-axis mode at 0.55mA, sleep mode at 3.5µA with wake-on-motion support for always-on experience[citation:6]
  • High Sensor Stability – Best-in-class stability against temperature drift, SMT/bend-induced offset, and out-of-band vibration noise; withstands shock up to 20,000g[citation:6]
  • On-Chip APEX Motion Processing Engine – Pedometer, tilt detection, low-g / freefall detection, wake on motion, significant motion detection[citation:6][citation:11]
  • Flexible Host Interface – Supports I²C (1MHz), I3C℠ (12.5MHz), and SPI (24MHz) for versatile system integration[citation:6]
  • Programmable Digital Filters – User-configurable filters for gyroscope, accelerometer, and temperature sensor[citation:6]
  • Compact Low-Profile Package – 2.5mm × 3mm × 0.76mm 14-pin LGA, ideal for space-constrained designs[citation:2][citation:3]
  • 2.25 KB FIFO Buffer – Reduces bus traffic and host processor loading with burst read support[citation:6][citation:11]
  • Wide Operating Range – VDD and VDDIO from 1.71V to 3.6V with -40°C to +85°C temperature range[citation:1][citation:3]

📦 Packaging & Ordering Information

Package Type 14-LGA (2.5mm × 3mm)
Standard Package Quantity 5,000 (Tape & Reel)[citation:6]
Part Status Active – Production[citation:1][citation:3]
MSL Rating Level-3-168H[citation:4][citation:9]

🔧 Key Applications

  • Wearables – Fitness bands, smartwatches, healthcare wearables (pedometer, tilt detection)[citation:6][citation:11]
  • Hearables – True wireless headsets with in-ear detection and wake-on-motion[citation:6]
  • Gaming & VR/AR – Gaming controllers, head tracking, augmented reality headsets[citation:6][citation:11]
  • Smart Home – Smart home appliances, TV remotes with gesture control[citation:6]
  • IoT & Robotics – Industrial robotics, drone navigation, motion-enabled IoT devices[citation:6][citation:11]

⚡ Working Principle & Architecture

The ICM-42670-P combines a 3-axis gyroscope and a 3-axis accelerometer into a single package with a shared digital motion processor. The device converts raw analog signals from the MEMS sensors into 16-bit digital outputs, which can be accessed through the configurable host interface. The on-chip APEX engine offloads complex motion algorithms from the host processor, enabling features like gesture recognition, pedometer, and tilt detection with minimal power overhead[citation:6][citation:11].

Key differentiation: The device features the lowest gyro and accelerometer noise in its IMU class, combined with highest stability against temperature, shock, and PCB bending induced offset, making it ideal for applications demanding high accuracy and reliability in challenging environments[citation:6].


📋 Compliance & Environmental

RoHS Status ROHS3 Compliant[citation:1][citation:4]
REACH Status REACH Unaffected[citation:4][citation:9]
US ECCN EAR99[citation:1][citation:4]
HTSUS 8542.39.0070[citation:4][citation:9]

For complete technical documentation including the full datasheet and application notes, please visit the TDK InvenSense product page or contact your authorized distributor. Evaluation boards (EV_ICM-42670-P) are available for development and testing[citation:2][citation:7].